The significance of X-Ray inspection equipment for SMT processing

The significance of X-Ray inspection equipment for SMT processing

Electronic technology is booming, electronic PCBA processing, packaging is high-precision and new miniaturization trend, and the assembly quality requirements for chip processing and plug-in processing are getting higher and higher, so higher specifications are proposed for detection methods and technologies. Claim. In order to meet the requirements, the new detection technology is constantly innovating. The application of automatic X-Ray detection technology is one of the best. It can not only detect invisible solder joints, such as BGA, but also qualitative and quantitative analysis of test results. In order to detect faults early.
 At present, there are many kinds of testing technologies used in the SMT processing industry. Commonly used are: manual visual inspection (MVI), in-circuit tester (ICT), and automatic optical inspection (AOI). ), Automatic X-Ray Inspection (AXI), Functional Tester (FT), etc.

The above mentioned detection methods have their own advantages and disadvantages:
1. Manual visual inspection is a method of visual inspection. The manual detection is unstable, the cost is high, and the detection of a large number of welded parts is not accurate.
2. Flying probe test is a machine inspection method. A PCB with a low density of device mounting is suitable, and it is not possible to accurately measure a high-density and miniaturized PCB of a device.
3. ICT needle bed testing is a widely used testing technique. The test speed is fast, suitable for a single variety of large-volume products, high cost of use, long production cycle, and small measurement difficulty (such as mobile phones).
4. Automatic Optical Inspection (AOI) is a detection method that has emerged in recent years. It obtains images of the device or PCB by means of CCD photography, and then through computer processing and analysis and comparison to judge defects and faults. The advantages are fast detection speed, short programming time, and can be placed in different positions in the production line, so that faults and defects can be found in time, and production and testing can be combined into one. The disadvantage is that circuit properties cannot be detected, such as circuit errors, which are not detected for invisible solder joints.
5. Functional testing. FT can effectively find various defects and faults that occur during SMT assembly. The detection is fast, rapid, simple to use, and low in investment, but it cannot automatically diagnose the fault and is not suitable for mass inspection.
6. Significant features of X-Ray detection technology: According to the understanding of various detection technologies and equipment, X-ray detection technology has more advantages than the above several detection technologies. It can improve our inspection system. For us to improve the "one-time pass rate" and strive for the goal of "zero defects", provide an effective means of detection.
(1) The coverage of process defects is as high as 97%. Inspectable defects include: solder joints, bridging, soldering, insufficient solder, pores, device missing, and so on. In particular, X-ray can also check for solder joint hidden devices such as BGA and CSP.
(2) Higher test coverage. It can be inspected where the naked eye and online tests are not available. For example, if PCBA is judged to be faulty, it is suspected that the inner layer of the PCB is broken, and X-ray can be checked quickly.
(3) The preparation time for testing is greatly shortened.
(4) It is possible to observe defects that cannot be reliably detected by other test methods, such as: virtual welding, air holes, and poor molding.
(5) It is only necessary to check the double-panel and multi-layer boards once (with layering function).
(6) Provide relevant measurement information to evaluate the production process. Such as the thickness of the solder paste, the amount of solder under the solder joints, and so on.
 In recent years, x-ray inspection equipment has developed rapidly. It has evolved from the past 2D inspection to 3D inspection. It has SPC statistical control function and can be connected with assembly equipment to realize real-time monitoring of assembly quality. At present, 3D detection devices are divided into two categories according to the layering function: no layering function and layering function.

For more info, please feel free to check x ray machine working performance video in below:
Chips:  https://youtu.be/wwxgDMCZ6_4
Venous indwelling needle: https://youtu.be/VIzlguyWlqM
Copper substrate PCB: https://youtu.be/1Or5vk7CaCg
LED DRIVER: https://youtu.be/nPEOxCsQ_gU
LED WICK: https://youtu.be/cLz9RL7cRsI
Circuit breaker: https://youtu.be/k2Jpo_ziHJQ
Speaker: https://youtu.be/sAsZCTTqPXY
LED: https://youtu.be/NtZ_VqmkZRE
Semiconductor: https://youtu.be/3vzZt3M2p6Q
BGA: https://youtu.be/Dnmt5FjQolg
Auto Parts: https://youtu.be/YEWJdRUrYqo
button: https://youtu.be/tK10ydAzbl8
DIP: https://www.youtube.com/watch?v=suL_yZn7Hyw
DIP switch: https://www.youtube.com/watch?v=suL_yZn7Hyw
Button: https://www.youtube.com/watch?v=tK10ydAzbl8

USB Disk: https://www.youtube.com/watch?v=h8wg_u3J-aY